Çë½ÌÒ»ÏÂmicronµÄProcess integration engineer
µÇ¼ | ÂÛ̳µ¼º½ -> »ªÐÂÏÊÊ -> ´´ÒµÇóÖ° | ±¾Ìû¹²ÓÐ 43 Â¥£¬µ±Ç°ÏÔʾµÚ 19 Â¥ : ´ÓÂ¥Ö÷¿ªÊ¼ÔĶÁ : ±¾ÌûÊ÷ÐÎÁбí : ·µ»ØÉÏÒ»Ò³
×÷Õߣº°§ÀÖÖ®áÛ (µÈ¼¶£º2 - ³õ³ö鮣¬·¢Ìû£º20) ·¢±í£º2012-02-21 16:43:52¡¡ 19Â¥¡¡
TECH¾ÍÊÇÇ®¶à°¡£¬¹ÜÀí¿ÁÑÏÄÜÔÚTECH×öÏÂÈ¥µÄ£¬Ð½Ë®¶¼ºÜ¸ß£¬µ¼ÖÂҲûʲô±ðµÄµØ·½È¥£¬ÒòΪмÓƱðµÄFAB´ó¶à¸¶²»ÆðËûÃǵÄнˮ£¬±»MICRONÊÕ¹ºÁËÖ®ºóÒ²¾ÍMICRO, IMF, TECHÈý¼ÒÄÚ²¿µ¹¡£È·ÇеÄ˵£¬ÏÖÔÚÒѾ­Ã»ÓÐTECHÁË£¬Ö»ÓÐMICRON¡£ °ëµ¼ÌåÖÆÔìÒµ£¬TSMC¾ø¶ÔÊÇÁúÍ·Àϴ󣬶¥¼âµÄÈ˲ţ¬¶¥¼âµÄ¼¼Êõ+¶¥¼âµÄÊÕÈ루ÌØÖ¸ÔŲ́ÍåTSMC¹¤×÷µÄÈË£¬²»ËãÖйú´ó½µÄ£©£¬³ÆµÃÉÏÊÇ¡°µç×Óй󡱡£SSMCÊÇTSMC¸úмÓÆÂÕâ±ßºÏ×ʵģ¬Ò²Ëã¸ßнÎȶ¨£¬Ìø²ÛµÄÈ˲»¶à£¬ÕÐƸµÄƵÂÊÒ²²»¸ß¡£ TSMC×î´óµÄ¶ÔÊÖÊÇÈýÐÇ£¬µ«ÊÇÈýÐÇÔÚмÓÆÂûFAB£¬²»Ìᣬ½ñÄêÕâÁ©ÀÏ´óÓÖ¿¸ÉÏÁË£¬¶¼ÔÚ½¨Ð³§ÇÀÈËÄØ£¬ÄáÂêÒѾ­ÒªÍ¶²ú10nm µÄ¼¼ÊõÁË£¬ÔÙС¹À¼ÆÖ»ÄÜÉÏ̼»ùÁË£¬¶ÔÎÒÕâÖÖ֮ǰ»¹ÔÚ×ö2um¹Å¶­¼¼ÊõµÄÈËÀ´Ëµ10nmʲôÑù×ÓÍêȫû¸ÅÄî¡£ UMC²»»¨Ç®Í¶×ÊR&D,Ç®¶¼»¨ÔÚ´ÓTSMCÍÚǽ½ÇÉÏÁË¡£TSMCÉÏÂíɶм¼Êõ£¬UMC¾Í»¨Ç®°ÑÈËÍÚ×ߣ¬ËùÒÔÕâÁ©¼Ò¼¼Êõ²îµÄ²»Ô¶£¬Ð¼ÓÆÂÕâ±ßнˮ´ýÓöÒ²²î±ð²»´ó£¬µ«ÊÇ̨ÍåµÄUMC´ýÓö¾Í±ÈTSMC²î¶àÁË¡£ ÔÚTECH¸ô±Ú¹¤×÷µÄȷͦÓôÃƵģ¬BONUSÉÙ£¬¼ÓнÉÙ£¬»¹¶¯²»¶¯´ó²ÃÔ±£¬±»³ÆΪµ­ÂíÎýÓÐÊ·ÒÔÀ´×îʧ°ÜµÄͶ×ÊÒ²²»¹ý·Ö£¬»¹ºÃÖÕÓÚ°ÑÕâ¸ö°ü¸¤¶ª³öÈ¥ÁË¡£ÏÖÔÚ¹ÜÀíÒ»Èç¼ÈÍùµÄ»ìÂÒ°¡£¬µ«ÊÇ×î½ü¸ÕÀ­µ½×ܲ¿µÄ´ó±ÊͶ×Ê£¬ÕýÔÚÕбøÂòÂí£¬Ä¦È­²ÁÕÆ×¼±¸´ó¸ÉÒ»·¬ÖС£×î½ (more...)
ssmcÎÒÉÏ´ÎÎÊÁË£¬Ëû˵ֻÕÐÑо¿ÉúÒÔÉϵÄ
¶øÇÒ²éÁËÏÂËûÃǵļ¼Êõ£¬È·Êµ±È½ÏÇ¿´ó¡£ÊDz»ÊÇÒªÔÚsemiconductorÐÐÒµ·¢Õ¹£¬masterÒÔÉϵIJŸúµÃÉÏÄØ£¿ÄÇÑùµÄ»°ÊDz»ÊǵÃ×¼±¸¶Á¸ö˶ʿ֮ÀàµÄÁË
»¶Ó­À´µ½»ªÐÂÖÐÎÄÍø£¬Ó»Ô¾·¢ÌûÊÇÖ§³ÖÎÒÃǵÄ×îºÃ·½·¨!Ô­ÎÄ / ´«Í³°æ / WAP°æÖ»¿´´ËÈË´ÓÕâÀïÕ¹¿ªÊÕÆðÁбí

±¾Ìû¹²ÓÐ 43 Â¥£¬µ±Ç°ÏÔʾµÚ 19 Â¥£¬±¾ÎÄ»¹ÓÐ N-1 ²ãÂ¥£¬Òª²»ÄãÊÔÊÔ¿´£ºµã»÷´Ë´¦ÔĶÁ¸ü¶à >>



ÇëµÇ¼ºó»Ø¸´£ºÕʺŠ¡¡ ÃÜÂë ¡¡